Recrystallization and Grain Growth of Cold drawn Gold bonding Wire

@inproceedings{Cho2003RecrystallizationAG,
  title={Recrystallization and Grain Growth of Cold drawn Gold bonding Wire},
  author={J.-H. Cho and J.-S. Cho and J. T. Moon and Jaehong Lee and Yong Heui Cho and Young Won Kim and Anthony D. Rollett and K. H. Oh},
  year={2003}
}
Recrystallization and grain growth of gold bonding wire have been investigated with Electron Back Scatter Diffraction (EBSD). The bonding wires were wire-drawn to an equivalent strain greater than 11.4 with final diameter between 25 and 30μm. Annealing treatments were carried out in a salt bath at 300°C, 400°C for 1 min, 10 min, 60 min, and 1 day. The… CONTINUE READING