Recent research development in flip-chip routing

@article{Lee2010RecentRD,
  title={Recent research development in flip-chip routing},
  author={Hsu-Chieh Lee and Yao-Wen Chang and Po-Wei Lee},
  journal={2010 IEEE/ACM International Conference on Computer-Aided Design (ICCAD)},
  year={2010},
  pages={404-410}
}
The flip-chip package is introduced for modern IC designs with higher integration density, larger I/O counts, faster speed, better signal integrity, etc. To ease design changes, an extra metal layer is introduced to redistribute nets between wire-bonding (I/O) pads in a die and bump pads in a package carrier. Flip-chip routing is performed by redistributing and interconnecting nets between the I/O and bump pads. As the design complexity grows, routing has played a pivotal role in flip-chip… CONTINUE READING

Citations

Publications citing this paper.
SHOWING 1-6 OF 6 CITATIONS

Flip-chip routing with IO planning considering practical pad assignment constraints

  • 2018 23rd Asia and South Pacific Design Automation Conference (ASP-DAC)
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Redistribution layer routing for wafer-level integrated fan-out package-on-packages

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