Recent development of temperature compensated SAW Devices

@article{Hashimoto2011RecentDO,
  title={Recent development of temperature compensated SAW Devices},
  author={Ken-ya Hashimoto and M. Kadota and Takeshi Nakao and Masanori Ueda and Michio Miura and Hiroyuki Nakamura and Hiroaki Nakanishi and Kenji Suzuki},
  journal={2011 IEEE International Ultrasonics Symposium},
  year={2011},
  pages={79-86}
}
This paper reviews recent progress of temperature compensated surface acoustic wave (SAW) devices for wireless communications. First, temperature compensation techniques based on the SiO2 deposition and the wafer bonding are explained, and their implementation into real devices are discussed. Finally, we will show how high performances have been realized by the use of these technologies. 

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