Real time resistance monitoring during sintering of silver paste

  title={Real time resistance monitoring during sintering of silver paste},
  author={Di Erick Xu and Jang Baeg Kim and Michael David Hook and Jae Pil Jung and Michael Mayer},
  journal={Journal of Alloys and Compounds},
MEMS Enabled Fast Time-Resolved X-Ray Diffraction Characterization Platform for Copper Nanoparticle Sintering in Heterogeneous Integration Applications
We report the design, fabrication and experimental investigation of a MEMS micro-hotplate (MHP) for fast time-resolved X-ray diffraction (TRXRD) study of Cu nanoparticle paste (nanoCu paste)
Effect of Sintering Pressure on the Porosity and the Shear Strength of the Pressure-Assisted Silver Sintering Bonding
The microstructure, thickness, porosity, and shear performance of the silver (Ag) sintering layers under different sintering pressures were investigated. Experimental results demonstrated that the
High Electrical and Thermal Conductivity of Nano-Ag Paste for Power Electronic Applications
The nano-Ag paste consisted of Ag nanoparticles and organic solvents. These organics would be removed by evaporation or decomposition during sintering. When the sintering temperature was 300 °C, the
Research_9874249 1..10
Four-wire measurements have been introduced by Lord Kelvin in 1861 and have since become the standard technique for characterizing small resistances and impedances. However, high-density 4-wire
A Novel Conductive Core–Shell Particle Based on Liquid Metal for Fabricating Real‐Time Self‐Repairing Flexible Circuits
As a critical part of flexible electronics, flexible circuits inevitably work in a dynamic state, which causes electrical deterioration of brittle conductive materials (i.e., Cu, Ag, ITO). Recently,
Twin-Wire Networks for Zero Interconnect, High-Density 4-Wire Electrical Characterizations of Materials
Four-wire measurements have been introduced by Lord Kelvin in 1861 and have since become the standard technique for characterizing small resistances and impedances. However, high-density 4-wire
Facile organic surfactant removal of various dimensionality nanomaterials using low-temperature photochemical treatment
Deep ultraviolet (DUV)-treatment is an efficient method for the removal of high-energy-barrier polymeric or aliphatic organic ligands from nanomaterials. Regardless of morphology and material, the


Pressure-assisted low-temperature sintering of silver paste as an alternative die-attach solution to solder reflow
Pressure-assisted low-temperature sintering of silver paste is shown to be a viable alternative to solder reflow as a die-attachment solution. A quasihydrostatic pressure is used to lower the
In-situ analysis of electrical conductivity evolution in epoxy-based conductive adhesives with Ag loading during curing process
Electrical conductivity evolution of ECAs composed of epoxy-based binders during curing was analyzed using an in-situ viscoelastic characterization (free-damped oscillation method). Variation in
Low-Temperature Sintering with Nano-Silver Paste in Die-Attached Interconnection
Traditional materials used in chip-level interconnections are not compatible with the high-temperature operation of wide-bandgap high-power semiconductor devices; therefore, this paper studies
Low temperature sintering of Ag nanoparticles for flexible electronics packaging
We achieve robust bonding of Cu wires to Cu pads on polyimide with silver nanopaste cured at 373 K. The paste is prepared by simply condensing Ag nanoparticle (NP) solution via centrifuging. The
Reliability of Ag Sintering for Power Semiconductor Die Attach in High-Temperature Applications
Low-temperature Ag sintering provides a lead-free die attachment method that is compatible with high-temperature (300 °C) power electronics applications. The reliability of sintered Ag die attach for
Effects of metallo-organic decomposition agents on thermal decomposition and electrical conductivity of low-temperature-curing silver paste
Six low-temperature-curing silver pastes were prepared from silver flake, α-terpineol and various metallo-organic decomposition (MOD) compounds. The thermal decomposition behaviors of the pastes were
Triggering the sintering of silver nanoparticles at room temperature.
It was discovered that silver nanoparticles behave as soft particles when they come into contact with oppositely charged polyelectrolytes and undergo a spontaneous coalescence process, even without heating, and using this finding in printing conductive patterns, enables achieving high conductivities even at room temperature.
Influence of curing procedures on the electrical properties of epoxy-based isotropic conductive adhesives
  • N. Xiong, Zhiling Li, Jingze Li, H. Xie, Yuehui Wang
  • Materials Science
    2014 Joint IEEE International Symposium on the Applications of Ferroelectric, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy
  • 2014
In this paper, a typical isotropic conductive adhesives (ICAs) composed of an epoxy-based binder containing micro-sized silver flakes was prepared and the effects of different curing procedures on