Rate-dependent behavior of Sn3.8Ag0.7Cu solder over strain rates of 10−6 to 102 s−1

@article{Nie2008RatedependentBO,
  title={Rate-dependent behavior of Sn3.8Ag0.7Cu solder over strain rates of 10−6 to 102 s−1},
  author={Xu Nie and Dhruv Bhate and Dennis K. Chan and Weinong W Chen and Ganesh Subbarayan and Indranath Dutta},
  journal={2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems},
  year={2008},
  pages={676-682}
}
Solder joints are subjected to different loading conditions depending on the application environment. Desktop and server applications for example, involve thermomechanical fatigue loads at low-strain rates and the dominant mode of failure is creep fatigue. Mobile electronics applications on the other hand, are subject to dynamic stresses on the solder joint… CONTINUE READING