RF and mechanical characterization of flip-chip interconnects in CPW circuits with underfill

@article{Feng1998RFAM,
  title={RF and mechanical characterization of flip-chip interconnects in CPW circuits with underfill},
  author={Zhiping Feng and Wenge Zhang and Bingzhi Su and K. C. Gupta and Y. C. Lee},
  journal={1998 IEEE MTT-S International Microwave Symposium Digest (Cat. No.98CH36192)},
  year={1998},
  volume={3},
  pages={1823-1826 vol.3}
}
RF characterization of flip-chip interconnects in CPW circuits with underfill has been investigated by measuring the scattering-parameters up to 40 GHz for GaAs coplanar waveguide (CPW) through line chips flip-chip mounted on alumina substrate with and without underfill epoxy. Fatigue life of flip-chip assemblies has been computed for different chip sizes and substrates. The results show feasibility of using underfill encapsulant in microwave/mm-wave frequency range. 
Highly Cited
This paper has 37 citations. REVIEW CITATIONS

Citations

Publications citing this paper.
Showing 1-10 of 27 extracted citations

References

Publications referenced by this paper.
Showing 1-10 of 10 references

Investigation of MMIC flip chips with Sealant for improved reliability without hermeticity

  • R. Sturdivant
  • 1996 IEEE MTT-S Digest, pp. 239-242.
  • 1996
Highly Influential
9 Excerpts

Alternative underfill methods for flip chip applications

  • C. Beddingfield, L. Higgins
  • SMTA National Symposium Emerging Packaging…
  • 1997

Corrosion/migration study of flip chip underfill and ceramic overcoating

  • R. Lachance
  • 1997 Proceedings. 47 th Electronic Components…
  • 1997

Flip chip underfill reliability of CSP during IR reflow soldering

  • Y. Ohshima
  • 1997 IEEE International Reliability Physics…
  • 1997

The effect of underfill epoxy on mechanical behavior of flip chip assembly

  • W. Zhang
  • 1997 Proceedings. 47 th Electronic Components…
  • 1997

The flip chip market

  • T. Goodman, E. Vardaman
  • Advanced Packaging, September/October 1997, pp…
  • 1997
1 Excerpt

Review of underfill encapsulant development and performance of flip chip applications

  • D. Zoba, M. Edwards
  • 1996 Proceedings of the SPIE - The International…
  • 1996

Ball Grid array Technology,

  • J. H. Lau
  • 1995
1 Excerpt

Characterization and evaluation of the underfill encapsulants for flip chip assembly

  • B. Wun, J. Lau
  • Circuit World, Vol. 21, No. 3, pp. 25-27.

The flip chip market The effect of underfill epoxy on mechanical behavior of flip chip assembly Flip chip underfill reliability of CSP during IR reflow soldering

  • M. Edwards

Similar Papers

Loading similar papers…