RF SiP Design Verification Flow with Quadruple LO Down Converter SiP

@inproceedings{Lee2007RFSD,
  title={RF SiP Design Verification Flow with Quadruple LO Down Converter SiP},
  author={Heesoo Lee and Dean Nicholson},
  year={2007}
}
The wireless industry trend toward higher integration and RF component miniaturization has been driving ongoing technology innovations, especially for substrate, interconnect, and packaging technologies. RF Systemin-Package (RF SiP) is one of those leading technology innovations. RF SiP is usually a sub-system unit, and it typically consists of multiple dies with or without passive components generally constructed from embedded passives (EP) and SMT technology. However some passive circuits can… CONTINUE READING

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