Question marks to the extrapolation to lower temperatures in high temperature storage life (HTSL) testing in plastic encapsulated IC'S

@article{Schuddeboom1996QuestionMT,
  title={Question marks to the extrapolation to lower temperatures in high temperature storage life (HTSL) testing in plastic encapsulated IC'S},
  author={Wouter Schuddeboom and Michael Wubbenhorst},
  journal={Proceedings of the 7th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis},
  year={1996},
  pages={1935-1938}
}
A model has been constructed to describe ball-bond corrosion in HTSL stress testing. In this model ion-mobility has been believed to be the rate determining step and has been found to be non-linear for the anti-popcorn plastic. In HTSL testing an Arrhenius type extrapolation of the mean-time to failure (MTTF) at high temperature has been used, to predict the value at lower temperatures. This method proves to be correct for a low-stress plastic. However possibly it underestimates the value for… CONTINUE READING

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Internal Report, Philips Signetics

J. le Gall
  • Sunnyvale
  • 1988
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