Quartz-based vibrating MEMS fabricated using a wafer-bonding process with sealed cavities

@article{Grousset2014QuartzbasedVM,
  title={Quartz-based vibrating MEMS fabricated using a wafer-bonding process with sealed cavities},
  author={Sebastien Grousset and Pierre Lavenus and Lamine Benaissa and Rachid Taibi and E. Augendre and Thomas Signamarcheix and Olivier Le Traon and Sylvain Ballandras},
  journal={2014 IEEE International Frequency Control Symposium (FCS)},
  year={2014},
  pages={1-4}
}
Here we present the results of a wafer-level approach allowing the collective fabrication of gyroscope sensors based on quartz vibrating MEMS. More specifically, we focus on suspended quartz tuning fork microstructures of a desired thickness over controlled depth cavities. This approach is based on the bonding and thinning of 4-inch z-cut quartz wafer on pre-structured silicon wafer. InfraRed (IR) inspection shows a large bonded area (>98%) while structural characterizations of the thinned… CONTINUE READING

Citations

Publications citing this paper.

Gold thin film viscoelastic losses of a length extension mode resonator

  • 2016 European Frequency and Time Forum (EFTF)
  • 2016
VIEW 3 EXCERPTS
CITES METHODS & BACKGROUND

References

Publications referenced by this paper.
SHOWING 1-9 OF 9 REFERENCES

The fairy world of quartz vibrating MEMS

  • 2012 European Frequency and Time Forum
  • 2012
VIEW 1 EXCERPT

A review of the recent development of temperature stable cuts of quartz for SAW applications.

C. S. Lam
  • International Symposium on Acoustic Wave Devices for Future Mobile Communication Systems,
  • 2010
VIEW 2 EXCERPTS

Silicon/quartz bonding and quartz deep RIE for the fabrication of quartz resonator structures

  • 2008 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems
  • 2008
VIEW 1 EXCERPT

Quartz vibrating gyro

D. Janiaud, O. Le Traon, B. Lecorre, S. Muller