Quantification of creep strain in small lead-free solder joints with the in-situ micro electronic-resistance measurement

Abstract

Single shear lap creep specimens with a 1 mm<sup>2</sup> cross sectional area (similar in size to small lead-free solder joints used in electronic packaging and jointing) between thin copper strips were developed and fabricated using lead-free solder (Sn-3.5Ag) to quantify their creep strain with in situ micro electronic-resistance measurement. Where the… (More)
DOI: 10.1016/j.microrel.2007.08.004

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