Property Comparisons and Bonding Efficiency of Uf and Pmdi Bonded Particleboards as Affected by Key Process Variables

@inproceedings{Papadopoulos2006PropertyCA,
  title={Property Comparisons and Bonding Efficiency of Uf and Pmdi Bonded Particleboards as Affected by Key Process Variables},
  author={Antonios N. Papadopoulos},
  year={2006}
}
The purpose of this paper was to compare physical properties of conventional particleboard bonded with amounts of UF and PMDI resin and to examine the effect of mat moisture content (MC), wax content and platen temperature on their bonding efficiency, as determined by internal bond strength. It was found that PMDI not only gave superior board properties compared with the UF, but the amount required was reduced considerably as well. The MC of the mat and the platen temperature did not… CONTINUE READING

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References

Publications referenced by this paper.
Showing 1-5 of 5 references

Particleboards and fiberboardsDetermination of swelling in thickness after immersion in water

  • W. FrinkJ., H. D. Layton
  • 1985

Particleboards : UF and PMDI resins

  • E. JohnsW., M. MaloneyT., J. B. Saunders, M. T. Lentz
  • 1982

The inclusion of 1% wax significantly affected the bonding efficiency of both resins, however the loss in strength was higher in UF than in PMDI bonded boards

  • A D.CITEDAdams
  • Proceedings of the 14 international particleboard…
  • 1980

The Effect of species and moisture content on the bonding efficiency of polymeric MDI isocyanate

  • O UdvardyG.
  • Proceedings of the 16 th international…
  • 1979

EMDI binder for particleboard and waferboard

  • J. DeppeH.
  • Proceedings of the 14 th international…
  • 1977

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