Productivity improvement of stack package line through die bonding process & scheme optimization

@article{Jin2008ProductivityIO,
  title={Productivity improvement of stack package line through die bonding process & scheme optimization},
  author={Xing Jin and Ming Li},
  journal={2008 International Conference on Electronic Packaging Technology & High Density Packaging},
  year={2008},
  pages={1-5}
}
  • Xing Jin, Ming Li
  • Published 2008 in
    2008 International Conference on Electronic…
To conform to the ever-emerging market demand, stacked memory devices have been more widely utilized. The stacking method also reduces the cost of electronical components through the way that stacking could fully utilize currently on-hand equipment without any new investment. While, starting from late 2003, flash memory manufacturers begin experience… CONTINUE READING