Processing, Properties and Electrical Reliability of Embedded Ultra-Thin Film Ceramic Capacitors in Organic Packages

Abstract

Traditional ceramic thick films have served the need for decoupling applications but require too high a temperature processing to be embedded in organic packages. Copper foil compatible sol-gel-derived ferroelectric thin film integration addresses this problem due to its unique advantages such as the ability to precisely control the composition of the films… (More)

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10 Figures and Tables