Process-dependent contact characteristics of NCA assemblies

@article{Cheng2004ProcessdependentCC,
  title={Process-dependent contact characteristics of NCA assemblies},
  author={Hsien-Chie Cheng and Cheng-Lin Ho and Kuo-Ning Chiang and Shyh-Ming Chang},
  journal={IEEE Transactions on Components and Packaging Technologies},
  year={2004},
  volume={27},
  pages={398-410}
}
The physical contact characteristics of a nonconductive adhesive (NCA) type of flip-chip-on-glass (FCOG) assemblies during manufacturing process and temperature variation is explored by using three-dimensional (3D), nonlinear finite element analysis together with the so-called "death-birth" simulation technique. The contact mechanics of two typical types of micro-bump bonding technologies, i.e., the metal (i.e. Au alloy) and composite bumps, are extensively addressed, and substantially compared… CONTINUE READING

References

Publications referenced by this paper.
Showing 1-10 of 14 references

Solder joint reliability of thermal enhanced BGA using a finite-volume-weighted averaging technique

  • H. C. Cheng, K. N. Chiang, C. K. Chen, J. C. Lin
  • J. Chinese Inst. Eng., vol. 24, no. 4, July 2001.
  • 2001
1 Excerpt

Interconnect resistance characteristics of several flip-chip bumping and assembly techniques

  • E. Nicewarner
  • Microelectron. Reliab., vol. 39, pp. 113–121…
  • 1999

Stress analysis of micro-bump bonding structure for chip-on-glass packaging

  • S. M. Chang, J. H. Jou, H. S. Wu, H. Y. Lin, C. Y. Wu
  • Proc. 5th Asian Symp. Information Display, 1999…
  • 1999
2 Excerpts

A novel flip chip technology using nonconductive resin sheet

  • S. Ito, M. Mizutani, H. Noro, M. Kuwamura, A. Prabhu
  • Proc. IEEE Electronic Components and Technology…
  • 1998

Characterization of electrical contacts made by nonconductive adhesive

  • H. Kristiansen, M. Gulliksen, H. Haugerud, R. Friberg
  • Proc. 3rd Int. Adhesive Joining and Coating…
  • 1998
1 Excerpt

Adhesive flip chip bonding on flexible substrates

  • A. Aschenbrenner, R. Misßner, H. Reichl
  • Proc. IEEE PEP’97 Conf., 1997, pp. 86–94.
  • 1997
1 Excerpt

Overview of conductive adhesive interconnection technologies for LCDs

  • H. Kristiansen, J. Liu
  • IEEE Trans. Comp., Packag., Manufact. Technol. A…
  • 1997
1 Excerpt

A new millimeter-wave IC on Si substrate using MBB technology

  • T. Yoshida, H. Fujimoto, +6 authors K. Inoue
  • Proc. 18th IEEE/CPMT Int. Conf., 1996, pp. 56–59.
  • 1996

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