Process-dependent contact characteristics of NCA assemblies

  title={Process-dependent contact characteristics of NCA assemblies},
  author={Hsien-Chie Cheng and Cheng-Lin Ho and Kuo-Ning Chiang and Shyh-Ming Chang},
  journal={IEEE Transactions on Components and Packaging Technologies},
The physical contact characteristics of a nonconductive adhesive (NCA) type of flip-chip-on-glass (FCOG) assemblies during manufacturing process and temperature variation is explored by using three-dimensional (3D), nonlinear finite element analysis together with the so-called "death-birth" simulation technique. The contact mechanics of two typical types of micro-bump bonding technologies, i.e., the metal (i.e. Au alloy) and composite bumps, are extensively addressed, and substantially compared… CONTINUE READING


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