Process and Material Characterization of Die Attach Film (DAF) for Thin Die Applications

Abstract

The main drivers for die attach film (DAF) implementation are package miniaturization and die thickness reduction, especially in applications requiring die thickness <100 mum. However, processing of DAF materials presents certain difficulties, especially in dicing of DAF-laminated wafers. This work outlines the challenges in terms of material selection… (More)

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Cite this paper

@article{Teo2006ProcessAM, title={Process and Material Characterization of Die Attach Film (DAF) for Thin Die Applications}, author={M. Teo and Soh Choew Kheng and C. Lee}, journal={2006 International Conference on Electronic Materials and Packaging}, year={2006}, pages={1-7} }