Process Window Centering for 22 nm Lithography

@article{Buengener2010ProcessWC,
  title={Process Window Centering for 22 nm Lithography},
  author={Ralf Buengener and Carol A. Boye and Bryan Rhoads and Sang Y Chong and Charu Tejwani and Sean D. Burns and Andrew D Stamper and Kourosh Nafisi and Colin J Brodsky and Susan S Fan and Sumanth Kini and Roland Hahn},
  journal={IEEE Transactions on Semiconductor Manufacturing},
  year={2010},
  volume={24},
  pages={165-172}
}
Process window centering (PWC) is an efficient methodology to validate or adjust and center the overall process window for a particular lithography layer by detecting systematic and random defects. The PWC methodology incorporates a defect inspection and analysis of the entire die that can be automated to provide timely results. This makes it a good… CONTINUE READING