Corpus ID: 113708899

Process Capability Optimization of Ball Bonding Using Response Surface Analysis in Light Emitting Diode(LED) Wire Bonding

@inproceedings{Kim2017ProcessCO,
  title={Process Capability Optimization of Ball Bonding Using Response Surface Analysis in Light Emitting Diode(LED) Wire Bonding},
  author={Byung-Chan Kim and S. Ha and Ji-Kyung Yang and I. Lee and Dong-Seong Kang and B. Han and Yu-Jin Han},
  year={2017}
}
In light emitting diode (LED) chip packaging, wire bonding is an important process that connects the LED chip on the lead frame pad with the Au wire and enables electrical operation for the next process. The wire bonding process is divided by two types: thermo compression bonding and ultrasonic bonding. Generally, the wire bonding process consists of three steps: 1st ball bonding that bonds the shape of the ball on the LED chip electrode, looping process that hangs the wire toward another… Expand

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