Principal component regression models for life prediction of plastic ball grid arrays on copper-core and no-core assemblies

@article{Lall2008PrincipalCR,
  title={Principal component regression models for life prediction of plastic ball grid arrays on copper-core and no-core assemblies},
  author={Pradeep Lall and Aniket Shirgaokar and Lisa Drake and Timothy Moore and Jeff Suhling and Manan Shah},
  journal={2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems},
  year={2008},
  pages={770-785}
}
In this paper, principal component regression models (PCR) have been investigated for reliability prediction and part selection of area package architectures under thermo- mechanical loads in conjunction with stepwise regression methods. Package architectures studied include, BGA packages mounted on CU-CORE and NO-CORE printed circuit assemblies in harsh environments. The models have been developed based on thermo-mechanical reliability data acquired on copper-core and no-core assemblies in… CONTINUE READING
4 Citations
27 References
Similar Papers

References

Publications referenced by this paper.
Showing 1-10 of 27 references

Effect of Simulation Methodology on Solder Joint Crack Growth Correlation

  • R. Darveaux
  • Proceedings of 50 ECTC,
  • 2000
Highly Influential
6 Excerpts

Reliability of Plastic Ball Grid Array Assembly, Ball Grid Array

  • R. Darveaux, K. Banerji, A. Mawer, G. Dody
  • 1995
Highly Influential
6 Excerpts

Constitutive Relations for Tin-Based Solder Joints

  • R. Darveaux, K. Banerji
  • IEEE Trans-CPMT-A,
  • 1992
Highly Influential
5 Excerpts

Thermo-Mechanical Reliability Based Part Selection Models for Addressing Part Obsolescence in CBGA, CCGA, FLEXBGA, and Flip- Chip Packages

  • P. Lall, G. Hariharan, A. Shirgaokar, J. Suhling, M. Strickland, J. Blanche
  • ASME InterPACK Conference,
  • 2007
1 Excerpt

Finite Element Modeling Predicts the Effects of Voids on Thermal Shock Reliability and Thermal Resistance of Power Device

  • J. Chang, L. Wang, J. Dirk, X. Xie
  • Welding Journal,
  • 2006
2 Excerpts

Risk Management Models for Flip-Chip Electronics in Extreme Environment

  • P. Lall, G. Hariharan, M. Strickland, J. Blanche, J. Suhling
  • Proceedings of the ASME International Mechanical…
  • 2006
1 Excerpt

Similar Papers

Loading similar papers…