Pressureless low temperature sintering of Ag nanoparticles for interconnects

Abstract

Cu-to-Cu interconnects were achieved by pressureless low temperature sintering of Ag nanoparticles for electronic packaging. Ag nanoparticles could be sintered so long as the chemical bonds by which organic shells connected with Ag nanoparticles were broken with no necessity that organic shells completely decomposed, which provided a way to lower bonding… (More)

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