Preparation and near zero thermal expansion property of Mn3Cu0.5A0.5N (A = Ni, Sn)/Cu composites

@inproceedings{Ding2011PreparationAN,
  title={Preparation and near zero thermal expansion property of Mn3Cu0.5A0.5N (A = Ni, Sn)/Cu composites},
  author={Lei Ding and Cong Kang Wang and Yuanyuan Na and Lihua Chu and Jun Jun Yan},
  year={2011}
}
In this work, Mn 3 Cu 0.5 A 0.5 N (A = Ni, Sn)/Cu composites with near zero thermal expansion property were successfully synthesized. It was found that the large positive thermal expansion of Cu can be effectively suppressed in the composite with the antiperovskite Mn 3 Cu 0.5 A 0.5 N (A = Ni, Sn). In particular, the composites show almost zero thermal expansion with a coefficient of thermal expansion of 4.7 × 10 −7  K −1 in the temperature range 290–320 K. We suggest that this offers a new… CONTINUE READING

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