Preliminary Test Plan for Reliability Evaluation of Copper- Based Metallization Systems

  • Ashok K. SharmaNASA
  • Published 2000

Abstract

The advantages of using copper for interconnection in microcircuits are mostly due to its lower resistance (bulk resistivity) compared to aluminum metallization. Copper-based metallization has specific resistance of less than 2 μΩ-cm compared to more than 3 μΩcm for aluminum metallization. In combination with a reduced susceptibility to electromigration… (More)

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