Prediction of wafer bow through thermomechanical simulation of patterned hard coated copper films

  title={Prediction of wafer bow through thermomechanical simulation of patterned hard coated copper films},
  author={Javad Zarbakhsh and Thomas Detzel and Rui Huang and Markus Leicht and Peter Nelle and S. W{\"o}hlert},
  journal={EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems},
Due to the large difference in the coefficients of thermal expansion of the materials used in advanced semiconductor manufacturing, the fabrication process of semiconductor chips leads to a wafer bow. In addition, the layers may pass through material phase changes, which generate an unwanted film stress, making the large accumulated wafer bow very difficult to handle. We have compared the wafer bow calculated from a thermomechanical finite element simulation with experiments, and developed new… CONTINUE READING
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