Prediction of interconnect pattern density distribution: derivation, validation, and applications

@inproceedings{ZarkeshHa2003PredictionOI,
  title={Prediction of interconnect pattern density distribution: derivation, validation, and applications},
  author={Payman Zarkesh-Ha and Ken Doniger and William Loh and Peter Wright},
  booktitle={SLIP},
  year={2003}
}
A rigorous derivation of the interconnect pattern density distribution for random logic networks is presented using the Bernoulli probability distribution. The derived analytical model provides a statistical interconnect pattern density distribution for a given wiring layer. Sampling window size, average wire length, wiring width and spacing, gate pitch, and wiring utilization are the input parameters.Monte-Carlo simulations agree with the results of the model. Comparison to product data shows… CONTINUE READING