Prediction of Electromigration Induced Voids and Time to Failure for Solder Joint of a Wafer Level Chip Scale Package

Abstract

This paper proposes a new prediction method for electromigration (EM) induced void generation of solder bumps in a wafer level chip scale package. The methodology is developed based on discretized weighted residual method in a user-defined finite element analysis framework to solve the local ME governing equation with the variable of atomic concentration… (More)

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