Power distribution paths in 3-D ICS


Distributing power and ground to a vertically integrated system is a complex and difficult task. Interplane communication and power delivery are achieved by through silicon vias (TSVs) in most of the manufacturing techniques for three-dimensional (3-D) circuits. As shown in this paper, these vertical interconnects provide additional low impedance paths for… (More)
DOI: 10.1145/1531542.1531605


12 Figures and Tables