Power Cycling Test Circuit for Thermal Fatigue Resistance Analysis of Solder Joints in IGBT

Abstract

The paper will give a detailed presentation of an active power cycling test bench in high temperature conditions developed to ageing the solder between the Direct Copper Bonding (DCB) and the base of IGBT devices. The average junction temperature measurement protocol, the temperature regulation of the base plate, the acquisition of all the electrical… (More)

Topics

9 Figures and Tables

Cite this paper

@inproceedings{Dupont2013PowerCT, title={Power Cycling Test Circuit for Thermal Fatigue Resistance Analysis of Solder Joints in IGBT}, author={L. Dupont and St{\'e}phane Lefebvre and Zoubir Khatir}, year={2013} }