Power, Thermal, and Reliability Modeling in Nanometer-Scale Microprocessors

  title={Power, Thermal, and Reliability Modeling in Nanometer-Scale Microprocessors},
  author={David M. Brooks and Robert P. Dick and Russ Joseph and Li Shang},
  journal={IEEE Micro},
System integration and performance requirements are dramatically increasing the power consumptions and power densities of high-performance microprocessors. High power consumption introduces challenges to various aspects of microprocessor and computer system design. It increases the cost of cooling and packaging design, reduces system reliability, complicates power supply circuitry design, and reduces battery life. Researchers have recently dedicated intensive effort to power-related design… CONTINUE READING
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