Post-packaging tuning of microresonators by pulsed laser deposition

@article{Chiao2003PostpackagingTO,
  title={Post-packaging tuning of microresonators by pulsed laser deposition},
  author={Mu Chiao and Liwei Lin},
  journal={TRANSDUCERS '03. 12th International Conference on Solid-State Sensors, Actuators and Microsystems. Digest of Technical Papers (Cat. No.03TH8664)},
  year={2003},
  volume={2},
  pages={1820-1823 vol.2}
}
  • Mu Chiao, Liwei Lin
  • Published 2003 in
    TRANSDUCERS '03. 12th International Conference on…
This paper presents a post-packaging tuning process for microresonators by PLD (Pulsed Laser Deposition). The microresonators are first hermetically packaged using the RTP (Rapid Thermal Processing) aluminum-to-silicon nitride bonding process. The resonator mass is then altered by adding materials on the surface of the structure using PLD to achieve the… CONTINUE READING