Polymer Adhesives and Encapsulants for Microelectronic Applications

Abstract

his article provides an overview of the use of polymer adhesives in microelectronic packaging, with key applications including die attachment, underfills, and encapsulants. For many applications, polymer adhesives provide several advantages over alternative materials, and polymers have been widely used for die attachment. In flip-chip devices, polymers are… (More)

Topics

14 Figures and Tables

Slides referencing similar topics