Polyimide foil flip-chip direct bonding

@article{Deckert2017PolyimideFF,
  title={Polyimide foil flip-chip direct bonding},
  author={Martin Deckert and Michael Thomas Lippert and Jakub Krzemix00F1ski and Kentaroh Takagaki and Frank W. Ohl and Bertram Schmidt},
  journal={2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition},
  year={2017},
  pages={1-4}
}
Recent developments in the field of neuroprosthetics have created a demand for cost-effective advanced bonding techniques to mount polymer-based, thin-film, multi-electrode arrays onto PCBs. Low thicknesses of polymer substrates present challenges for common packaging technologies. Here we implemented a cost-effective direct bonding process of polyimide… CONTINUE READING