PoP/CSP warpage evaluation and viscoelastic modeling

@article{Lin2008PoPCSPWE,
  title={PoP/CSP warpage evaluation and viscoelastic modeling},
  author={Wei Hua Lin and Min Woo Lee},
  journal={2008 58th Electronic Components and Technology Conference},
  year={2008},
  pages={1576-1581}
}
The purpose of this paper was to evaluate the critical factors for package-on-package (PoP) and chip scale package (CSP) warpage control through experiments and modeling. Shadow moire was used to measure package warpage from room temperature to reflow temperature. The impact of new developments in laminate substrate technology including thin core and emerging low CTE core materials were emphasized in addition to the effects of die size and mold compound material. Warpage data for the package… CONTINUE READING
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