Plasma Jet-Substrate Interaction in Low Pressure Plasma Spray-CVD Processes

@article{Guittienne2011PlasmaJI,
  title={Plasma Jet-Substrate Interaction in Low Pressure Plasma Spray-CVD Processes},
  author={Ph. Guittienne and D. La Grange and Ch. Hollenstein and Malko Gindrat},
  journal={Journal of Thermal Spray Technology},
  year={2011},
  volume={21},
  pages={202-210}
}
Conventional equipment for plasma spraying can be adapted for operation at low pressure so that PECVD-like processing can be performed. The plasma jet generated by the torch is characterized by a high convective velocity and a high gas temperature. The influence of these properties on a deposition process are investigated in the framework of simple theoretical considerations and illustrated by various experimental results obtained with SiOx deposition. A conclusion of this study is that the… Expand
5 Citations
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