Planarity-tolerant fine-pitch reworkable interconnections with sharp protrusions and microbumps

Abstract

Fine-pitch inter-strata connections in 3-D stacking lack rework solutions which can aide in early learning for 3-D integration. Reduced solder volume in the microbump or micropillar is also less tolerant to non-planarity and non-uniformity of the strata and interconnection array, especially as die size and number of interconnections increase. At fine pitch… (More)

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