Piezoelectricity, piezoresistivity and dielectricity discovered in solder

@article{Xi2019PiezoelectricityPA,
  title={Piezoelectricity, piezoresistivity and dielectricity discovered in solder},
  author={Xiang Xi and D. D. L. Chung},
  journal={Journal of Materials Science: Materials in Electronics},
  year={2019},
  volume={30},
  pages={4462-4472}
}
  • Xiang Xi, D. Chung
  • Published 17 January 2019
  • Materials Science
  • Journal of Materials Science: Materials in Electronics
The performance and reliability of soldered joints are important for electronic packaging. This work provides the first observation of piezoelectricity (generating electric field and capacitance), piezoresistivity (changing the resistivity) and dielectricity (giving polarization) in solder. These effects influence electrical conduction. The solder may encounter stress (particularly thermal stress) during use in a soldered joint. The solder studied is the tin–lead eutectic alloy. The stress is… 
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