This paper explores the possibility of piezoelectric actuators with integrated high-voltage power electronics. Such devices dramatically simplify the application of piezoelectric actuators since the power electronics are already optimized for the voltage range, capacitance, and power dissipation of the actuator. The foremost consideration is the thermal impedance of the actuator and heat dissipation. Analytical and finite-element methods are described for predicting the thermal impedance of a piezoelectric bender. The predictions are compared experimentally using thermal imaging on a piezoelectric bender with laminated miniature power electronics.