Physics-of-Failure Lifetime Prediction Models for Wire Bond Interconnects in Power Electronic Modules

  title={Physics-of-Failure Lifetime Prediction Models for Wire Bond Interconnects in Power Electronic Modules},
  author={Lei Yang and Pearl A. Agyakwa and C. Mark Johnson},
  journal={IEEE Transactions on Device and Materials Reliability},
This paper presents a review of the commonly adopted physics-of-failure-based life prediction models for wire bond interconnects in power electronic modules. In the discussed models, lifetime is generally accounted for by loading temperature extremes alone. The influence of the time spent at temperature on bond wear-out behavior and damage removal phenomena resulting from thermally activated processes is not addressed. The phenomenological considerations based on some unusual observations… CONTINUE READING
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Publications referenced by this paper.
Showing 1-10 of 47 references

Thermal Fatigue Life Evaluation of Aluminum Wire Bonds

2006 1st Electronic Systemintegration Technology Conference • 2006
View 5 Excerpts
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Accelerated mechanical fatigue testing and lifetime of interconnects in microelectronics

G. Khatibi, M. Lederer, +3 authors H. Danninger
Proc. Eng., vol. 2, no. 1, pp. 511–519, Apr. 2010. • 2010
View 4 Excerpts
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Anomalous reliability behaviour of 99.99% and 99.999% pure aluminium wire bonds under thermal cycling

P. A. Agyakwa, W. S. Loh, +3 authors C. M. Johnson
Proc. 41st IMAPS, Providence, RI, 2008. • 2008
View 4 Excerpts
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Low-cycle fatigue of ultrafine-grained aluminum at low temperatures

Y. Nakanishi, T. Fujii, S. Onaka, M. Kato
Mater. Trans., vol. 52, no. 5, pp. 890–894, May 2011. • 2011
View 1 Excerpt

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