Physics-Based Via and Trace Models for Efficient Link Simulation on Multilayer Structures Up to 40 GHz

@article{RimoloDonadio2009PhysicsBasedVA,
  title={Physics-Based Via and Trace Models for Efficient Link Simulation on Multilayer Structures Up to 40 GHz},
  author={Renato Rimolo-Donadio and Xiaoxiong Gu and Y. Kwark and Malte C. Ritter and Bruce Archambeault and Francesco de Paulis and Yaojiang Zhang and Jun Fan and H. Tom Bruns and Christian D. Schuster},
  journal={IEEE Transactions on Microwave Theory and Techniques},
  year={2009},
  volume={57},
  pages={2072-2083}
}
Analytical models for vias and traces are presented for simulation of multilayer interconnects at the package and printed circuit board levels. Vias are modeled using an analytical formulation for the parallel-plate impedance and capacitive elements, whereas the trace-via transitions are described by modal decomposition. It is shown that the models can be applied to efficiently simulate a wide range of structures. Different scenarios are analyzed including thru-hole and buried vias, power vias… CONTINUE READING
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