Physically-Based Compact Thermal Modeling — Achieving Parametrization and Boundary Condition Independence

@inproceedings{Huang2004PhysicallyBasedCT,
  title={Physically-Based Compact Thermal Modeling — Achieving Parametrization and Boundary Condition Independence},
  author={Wei Huang and Mircea R. Stan and Kevin Skadron},
  year={2004}
}
This paper presents an approach of compact thermal modeling —HotSpot, which is parameterized according to design geometrical dimensions and material physical properties. While most existing compact thermal modeling methods facilitate thermal analysis of existing package designs, the HotSpot modeling method is more suitable for the exploration of new designs at both the die level and the package level due to its physically-based parametrization characteristics. Although it may not be as “compact… CONTINUE READING

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