Performance of Polishing Slurries containing Silica Particles grown by Sol-Gel Method

@inproceedings{Bae2000PerformanceOP,
  title={Performance of Polishing Slurries containing Silica Particles grown by Sol-Gel Method},
  author={Sun Hyuk Bae and Jae-Hyun So and S Yang and Do Hyun Kim},
  year={2000}
}
Silica slurry used as abrasives in wafer polishing process is made by dispersing silica particles in an alkali solution. Since commercially available colloidal or fumed silica particles need some modifications to be directly used as abrasive slurry due to their small sizes, irregular shapes or broad size distribution, we have prepared silica abrasives by… CONTINUE READING