Performance evaluation of MCM chip-to-chip interconnections using custom I/O buffer designs

  title={Performance evaluation of MCM chip-to-chip interconnections using custom I/O buffer designs},
  author={Robert C. Frye and Thaddeus J. Gabara and King L. Tai and Wilhelm C. Fischer and Scott C. Knauer},
  journal={Sixth Annual IEEE International ASIC Conference and Exhibit},
  • R. Frye, T. Gabara, S. Knauer
  • Published 27 September 1993
  • Business
  • Sixth Annual IEEE International ASIC Conference and Exhibit
Compared to conventional packaging, multichip modules have significantly reduced capacitive loading in their interconnections. The authors present experimental results showing the performance of I/O buffers specially designed to operate in this environment, evaluated in several different silicon-on-silicon test modules.<<ETX>> 

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