Performance and testing of thermal interface materials

  title={Performance and testing of thermal interface materials},
  author={J. P. Gwinn and R. L. Webb},
  journal={Microelectronics Journal},
The increasing power and reduced die size of CPUs used in computers increases a need for significantly improved thermal interface materials (TIM). The TIM is used to reduce contact resistance at the CPU-heat sink interface. This work provides a state-of-the-art assessment on “thermal interface materials,” including fundamentals, materials used, their performance, and how interface resistance is measured. The performance of new commercial interface materials is given, as well as discussion of… CONTINUE READING
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