Performance analysis of through silicon via (TSV) and through glass via (TGV) for different materials

Abstract

Through silicon via (TSV) is one of the key components of the emerging 3D ICs. However, increasing number of TSVs in smaller silicon area leads to some severe negative impacts on the performance of the 3D IC. Growing signal integrity issues in TSVs is one of the major challenges of 3D integration. In this paper, different materials for the cores of the vias… (More)
DOI: 10.1109/ISCAS.2015.7169057

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Cite this paper

@article{Yousuf2015PerformanceAO, title={Performance analysis of through silicon via (TSV) and through glass via (TGV) for different materials}, author={Abdul Hamid Bin Yousuf and Nahid M. Hossain and Masud H. Chowdhury}, journal={2015 IEEE International Symposium on Circuits and Systems (ISCAS)}, year={2015}, pages={1957-1960} }