Performance Comparisons Between Carbon Nanotubes, Optical, and Cu for Future High-Performance On-Chip Interconnect Applications

@article{Koo2007PerformanceCB,
  title={Performance Comparisons Between Carbon Nanotubes, Optical, and Cu for Future High-Performance On-Chip Interconnect Applications},
  author={Kyung-Hoae Koo and Hoyeol Cho and Pawan Kapur and K. C. Saraswat},
  journal={IEEE Transactions on Electron Devices},
  year={2007},
  volume={54},
  pages={3206-3215}
}
Optical interconnects and carbon nanotubes (CNTs) present promising options for replacing the existing Cu-based global/semiglobal (optics and CNT) and local (CNT) wires. We quantify the performance of these novel interconnects and compare it with Cu/low-kappa wires for future high-performance integrated circuits. We find that for a local wire, a CNT bundle exhibits a smaller latency than Cu for a given geometry. In addition, by leveraging the superior electromigration properties of CNT and… CONTINUE READING
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