Performance Analysis and Optimization of High Density Tree-Based 3D Multilevel FPGA

Abstract

A novel 3D Tree-based Multilevel FPGA architecture that unifies two unidirectional programmable interconnection network is presented in this paper. In a Tree based architecture, the interconnects are arranged in a multi-level network with the logic blocks placed at different Tree levels using Butterfly-Fat-Tree network topology. 2D physical layout development of a Tree-based mul-tilevel interconnect network is a major challenge for Tree-based FPGA. A 3D interconnect network technology leverage on Through Silicon Via (TSVs) to redistribute the Tree interconnects, based on network delay and thermal considerations into multiple silicon layers discussed. The impact of of Through Silicon Vias and performance improvement on 3D Tree-based FPGA analyzed and also an optimized physical design technology leveraging on TSV, Thermal-TSV (TTSV), and thermal analysis are presented. Compared to 3D Mesh-based FPGA, the 3D Tree-based FPGA design reduces the number of TSVs by 29% and a performance improvement of 53% recorded in our place and route experiments.

DOI: 10.1007/978-3-642-36812-7_19

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