• Engineering
  • Published 1998

Pentium® II processor packaging : Thermal management of SRAM's in a S.E.C. cartridge

@inproceedings{Chiu1998PentiumIP,
  title={Pentium® II processor packaging : Thermal management of SRAM's in a S.E.C. cartridge},
  author={C.-P. Chiu and R. Viswanath and Gary Lawrence Solbrekken},
  year={1998}
}
The Single Edge Contact (S.E.C.) cartridge is Intel's innovative packaging design which enables high performance to be delivered to mainstream systems. Using this technology, the core and L2 cache are fully enclosed in a metal and plastic cartridge. These sub-components are surface mounted directly to a substrate inside the cartridge to enable high-frequency operation. The S.E.C. cartridge technology allows the use of widely available and high-performance industry burst pipeline synchronous… CONTINUE READING