Peak-to-Peak Ground Noise on a Power Distribution TSV Pair as a Function of Rise Time in 3-D Stack of Dies Interconnected Through TSVs

@article{Ahmad2011PeaktoPeakGN,
  title={Peak-to-Peak Ground Noise on a Power Distribution TSV Pair as a Function of Rise Time in 3-D Stack of Dies Interconnected Through TSVs},
  author={Waqar Ahmad and Li-Rong Zheng and Qiang Chen and Hannu Tenhunen},
  journal={IEEE Transactions on Components, Packaging and Manufacturing Technology},
  year={2011},
  volume={1},
  pages={196-207}
}
Supply grids of integrated chips are interconnected through through-silicon vias (TSVs) in modern design techniques to form a 3-D stack in vertical direction. The load on each chip is supplied through (power/ground) TSV pairs. Accurate estimation of power/ground noise on each TSV pair of a 3-D power distribution network is necessary for a robust power supply design. The worst case noise obtained with fast switching characteristics may not be significantly accurate. The behavior of power/ground… CONTINUE READING

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