Patterning of wafer level applied non-conductive adhesives (NCAs) for camera image sensor (CIS) modules

In this study, wafer level NCA patterning processes for CIS modules have been demonstrated and the effects of whole processes on NCAs were also investigated. At first, NCA solution was directly coated on a bumped wafer with Cu passivation on an image sensing area. Cu was sputtered on a NCA coated wafer, and then sputtered Cu layer was patterned using a… (More)