Passively assembled optical interconnection system based on an optical printed-circuit board

@inproceedings{Hwang2006PassivelyAO,
  title={Passively assembled optical interconnection system based on an optical printed-circuit board},
  author={Sung Hwan Hwang and Mu Hee Cho and Sae-kyoung Kang and Hyo-Hoon Park and Han Seo Cho and Sang Hoon Kim and Kyoung-up Shin and Sang-Won Ha},
  year={2006}
}
We propose a passively assembled chip-to-chip optical interconnection system using fiber-optic technology. To demonstrate the system, three components were prepared: a fiber-embedded optical printed-circuit board (OPCB), optical transmitter/receiver modules, and 90/spl deg/-bent fiber connectors. All components were assembled using precise guide pins and holes so that complete passive alignment was achieved in the OPCB. An optical link of 5-Gb/s/ch signals with a total link loss of -1.5 dB has… CONTINUE READING

Citations

Publications citing this paper.
SHOWING 1-10 OF 33 CITATIONS

An Inter/Intra-Chip Optical Network for Manycore Processors

  • IEEE Transactions on Very Large Scale Integration (VLSI) Systems
  • 2015
VIEW 1 EXCERPT
CITES BACKGROUND

UNION: A Unified Inter/Intrachip Optical Network for Chip Multiprocessors

  • IEEE Transactions on Very Large Scale Integration (VLSI) Systems
  • 2014
VIEW 1 EXCERPT
CITES BACKGROUND

Low-Cost PCB-Integrated 10-Gb/s Optical Transceiver Built With a Novel Integration Method

  • IEEE Transactions on Components, Packaging and Manufacturing Technology
  • 2013
VIEW 1 EXCERPT
CITES BACKGROUND