Passive-intermodulation analysis between rough rectangular waveguide flanges

  title={Passive-intermodulation analysis between rough rectangular waveguide flanges},
  author={C. Vicente and H. L. Hartnagel},
  journal={IEEE Transactions on Microwave Theory and Techniques},
A new model is presented for the calculation of passive intermodulation (PIM) in waveguide connections. The model considers the roughness of interconnecting waveguide surfaces and the presence of an insulator layer (oxide and contaminants) on these metal surfaces. This results in the generation of a contact resistance, which can excite the PIM level. In particular, the case in which metal-insulator-metal regions are the PIM source is especially investigated. The intermodulation level response… CONTINUE READING
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