Parallel electrostatic grippers for layered assembly

@article{Mici2019ParallelEG,
  title={Parallel electrostatic grippers for layered assembly},
  author={Joni Mici and Jang Won Ko and Jared D West and Jeffrey F Jaquith and Hod Lipson},
  journal={Additive Manufacturing},
  year={2019}
}
7 Citations
Electroadhesion Technologies for Robotics: A Comprehensive Review
TLDR
This survey comprehensively detail the working principle, modeling, design, fabrication, characterization, and applications of EA technologies employed in robotics, aiming to provide guidance and offer potential insights for future EA researchers and applicants.
Stretchable and Soft Electroadhesion Using Liquid‐Metal Subsurface Microelectrodes
Electroadhesion is an attractive mechanism to electrically modulate adhesion to surfaces. Electroadhesion arises from the interaction of electric fields with conductive or dielectric materials.
Layered assemblers for scalable parallel integration
TLDR
It is suggested that scalable layered assembly approaches, combined with a growing repertoire of standardized passive and active building blocks could help bridge the meso-scale assembly gap, and open the door to the fabrication of increasingly complex, adaptive and recyclable systems.
Layer-Scale and Chip-Scale Transfer Techniques for Functional Devices and Systems: A Review
  • Z. Gong
  • Computer Science
    Nanomaterials
  • 2021
TLDR
It is shown that a wide range of materials, devices, and systems with expanded functionalities and improved performance can be demonstrated by using layer transfer and chip transfer techniques for many applications, such as microdisplays and flexible electronics.
Dependence of Multijunction Optimal Gaps on Spectral Variability and Other Environmental and Device Parameters
We present a method to calculate the yearly energy production of multijunctions including spectral variations. We use it to find the optimal band gaps yielding maximum energy production. The band

References

SHOWING 1-10 OF 30 REFERENCES
Validation of electroadhesion as a docking method for spacecraft and satellite servicing
An electrostatic gripping force is created when a non-conducting dielectric is placed between a conducting material and a series of oppositely charged monopolar electrodes. Given the non-uniformity
High-precision modular microfluidics by micromilling of interlocking injection-molded blocks.
TLDR
This work presents a new approach to the design and construction of high-precision modular microfluidics, using standard injection-molded blocks that are modified using micromilling and assembled via elastically averaged contacts, encouraging use in both research and education.
Methods of Parallel Voxel Manipulation for 3D Digital Printing
A novel digital printing concept is explored for desktop fabrication of multimaterial objects with arbitrary 3D geometry. Digital objects are composed of many discrete, self-aligning voxels instead
Rapid Assemblers for Voxel-Based VLSI Robotics
Abstract : The goal of this research is to develop scalable fabrication methods and design tools for assembling large scale robots out of billions of micro scale building blocks (voxels) arranged on
Design and analysis of digital materials for physical 3D voxel printing
TLDR
The use of pre‐existing physical voxels as a material building‐block for layered manufacturing is studied and the theoretical underpinnings for a fundamentally new massively parallel additive fabrication process in which 3D matter is digital are presented.
Freeform fabrication of zinc‐air batteries and electromechanical assemblies
This paper reports on a fabrication platform and extensions to deposition‐based processes that permit freeform fabrication of three‐dimensional functional assemblies with embedded conductive wiring
Multi-Material 3D Printing
Digital manufacturing has garnered significant exposure recently with many announcements of new 3D printers, improved capabilities to print different materials, and the White House’s announcement of
...
1
2
3
...